SEMIFIVE and Mobilint have joined forces to develop a specialized robotics AI chip for South Korea's K-On-Device AI program.
SEMIFIVE has signed a turnkey development contract with South Korean AI semiconductor company Mobilint. The partnership will focus on creating a specialized robotics AI chip as part of Korea's 'K-On-Device AI Semiconductor Technology Development' program.
What Happened
Announced on October 1, 2026, the agreement pairs custom AI semiconductor solution provider SEMIFIVE with Mobilint to engineer a new AI chip tailored for robotics. The project operates under the 'K-On-Device AI Semiconductor Technology Development' initiative, which is led by South Korea's Ministry of Trade, Industry and Resources (MOTIR).
The development will utilize SEMIFIVE's 'Spec Hand-off' model. Under this framework, the customer defines the performance targets and specifications, while SEMIFIVE takes charge of the subsequent phases, including detailed design, packaging, testing, and eventual mass production.
Key Details
- Partnering companies: SEMIFIVE and Mobilint
- Program: 'K-On-Device AI Semiconductor Technology Development' program, led by Korea's Ministry of Trade, Industry and Resources (MOTIR)
- Development Model: 'Spec Hand-off' model
- Target Application: Deployment in applications such as agricultural robots to process vision and sensor data in real time
- Integrated Technologies: LPDDR6, PCIe Gen6, and UCIe-S
- Announcement Date: October 1, 2026
Why It Matters
The collaboration expands SEMIFIVE's application portfolio beyond data center, high-performance computing (HPC), and edge AI into the physical AI and robotics sector. For SEMIFIVE, extending its end-to-end ASIC capabilities into robotics AI marks a major step in diversifying its business portfolio.
What We Know So Far
All details regarding the turnkey contract, the involvement of MOTIR's program, and the integration of LPDDR6, PCIe Gen6, and UCIe-S technologies are officially confirmed via the announcement.
