Midea to Showcase Hyperconverged Tech at DCW Asia 2026
Midea Building Technologies is set to exhibit an industry-first power-cooling hyperconverged architecture and AI cooling solutions at Data Centre World Asia 2026.
Midea Building Technologies (MBT) is set to exhibit at Data Centre World Asia 2026 in Singapore, where it will present an industry-first power-cooling hyperconverged architecture. The company will also showcase a full-stack AI data centre cooling solution and highlight its ongoing collaboration with Keppel.
What Happened
Midea Building Technologies is participating in Data Centre World Asia 2026, held on September 29-30 at Marina Bay Sands in Singapore. At Booth T10, MBT is featuring three major highlights: an industry-first power-cooling hyperconverged architecture, a full-stack AI data centre (AIDC) cooling solution comprising three flagship products, and its strategic collaboration with Keppel.
In addition to the physical exhibition, Midea is scheduled to release an Omdia white paper on the afternoon of September 29. MBT is also launching the AIDC Converged Infrastructure White Paper, which was developed in partnership with CLOU Electronics.
Key Details
- Event: Data Centre World Asia 2026 at Marina Bay Sands, Singapore
- Dates: September 29-30, 2026
- Location: Booth T10
- Magnetic CDU: Integrates a magnetic-bearing cooling source with coolant distribution, reducing the equipment footprint by up to 70% and supporting a system PUE below 1.2 under suitable operating conditions.
- Gui'an Midea Cloud Data Centre: Combines MBT's HVAC capabilities with Keppel's digital infrastructure expertise to deliver up to 7,654 hours of free cooling annually at a stable PUE below 1.2.
- White Papers: Launch of the AIDC Converged Infrastructure White Paper developed with CLOU Electronics, alongside an Omdia white paper commissioned by Midea to be released on the afternoon of September 29.
Why It Matters
The introduction of a power-cooling hyperconverged architecture and specialized cooling products addresses the growing demands of AI workloads, which push rack densities far beyond traditional limits. Technologies like the Magnetic CDU and joint infrastructure projects aimed at achieving stable PUE levels below 1.2 point to efforts in improving data center efficiency and spatial footprint.
What We Know So Far
All presented facts are confirmed by the event announcements and schedules for Data Centre World Asia 2026, with no unconfirmed rumors or speculation noted.
