SK Hynix has been awarded Partner of the Year by TSMC for the second consecutive year, highlighting their ongoing collaboration on HBM5 memory validation.
SK Hynix has been awarded 'Partner of the Year' by TSMC for the second consecutive year in the 3DFabric-HBM Integration category. The recognition comes as the companies collaborate on validating HBM5, an eighth-generation high-bandwidth memory.
What Happened
SK Hynix received the 'Partner of the Year' honor in recognition of its collaborative achievements with TSMC, the world's largest foundry company, in validating HBM5. The award was highlighted during the TSMC Open Innovation Platform (OIP) Conference held in Santa Clara, California.
At the event's exhibition booth, SK Hynix unveiled next-generation artificial intelligence memory products. These included the 36GB 12-layer HBM4 and the 96GB SOCAMM2, which are slated for integration into NVIDIA's next-generation AI platform, Vera Rubin.
Key Details
- SK Hynix was selected as 'Partner of the Year' in the 3DFabric-HBM Integration category for two consecutive years.
- The company began shipping HBM4 in the second quarter of the current year and has supplied samples of HBM4E to major customers.
- Highlighted products showcased alongside NVIDIA's Vera Rubin platform include 36GB 12-layer HBM4 and 96GB SOCAMM2.
- HBM5 represents an eighth-generation high-bandwidth memory, positioning it three generations ahead of HBM3E.
Why It Matters
The continued partnership between SK Hynix and TSMC demonstrates close alignment in advancing high-bandwidth memory technologies like HBM5 and HBM4. By showcasing products integrated into NVIDIA's upcoming platforms, the collaboration plays a direct role in supporting next-generation artificial intelligence hardware infrastructure.
